In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint - Archive ouverte HAL Access content directly
Journal Articles Journal of Electronic Materials Year : 2022

In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint

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L. Yedra
É. Héripré
  • Function : Author
V. Aubin
J.-H. Schmitt
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hal-03887705 , version 1 (06-12-2022)

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L. Cornet, L. Yedra, É. Héripré, V. Aubin, J.-H. Schmitt, et al.. In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint. Journal of Electronic Materials, 2022, 51 (4), pp.1568-1582. ⟨10.1007/s11664-021-09390-w⟩. ⟨hal-03887705⟩
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