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Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope

Abstract : A Kossel microdiffraction experimental set up is under development inside a Scanning Electron Microscope (SEM) in order to determine the crystallographic orientation as well as the inter- and intragranular strains and stresses on the micron scale, using a one cubic micrometer spot. The experimental Kossel line patterns are obtained by way of a CCD camera and are then fully indexed using a home-made simulation program. The so-determined orientation is compared with Electron Back-Scattered Diffraction (EBSD) results, and in-situ tests are performed inside the SEM using a tensile/compressive machine. The aim is to verify a 50MPa stress sensitivity for this technique and to take advantage from this microscope environment to associate microstructure observations (slip lines, particle decohesion, crack initiation) with determined stress analyses.
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https://hal-cnrs.archives-ouvertes.fr/hal-03864532
Contributor : Jean-Sébastien LECOMTE Connect in order to contact the contributor
Submitted on : Monday, November 21, 2022 - 7:14:36 PM
Last modification on : Tuesday, November 22, 2022 - 3:50:15 AM

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Raphaël Pesci, Karim Inal, Sophie Berveiller, Etienne Patoor, Jean Sébastien Lecomte, et al.. Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope. Materials Science Forum, 2006, 524-525, pp.109-114. ⟨10.4028/www.scientific.net/MSF.524-525.109⟩. ⟨hal-03864532⟩

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