Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components - Archive ouverte HAL Access content directly
Journal Articles Microelectronics Reliability Year : 2020

Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components

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hal-03011618 , version 1 (21-11-2022)

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Attribution - NonCommercial - CC BY 4.0

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E. Ben Romdhane, A. Guédon-Gracia, S. Pin, P. Roumanille, H. Frémont. Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components. Microelectronics Reliability, 2020, pp.113812. ⟨10.1016/j.microrel.2020.113812⟩. ⟨hal-03011618⟩
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