Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability - Archive ouverte HAL Access content directly
Journal Articles Microelectronics Reliability Year : 2020

Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability

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Engineering Sciences [physics] Engineering Sciences [physics] Micro and nanotechnologies/Microelectronics
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Submitted on : Monday, November 21, 2022-11:17:08 AM

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hal-03011606 , version 1 (21-11-2022)

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F. Arabi, A. Gracia, J.-Y. Delétage, H. Frémont. Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability. Microelectronics Reliability, 2020, pp.113883. ⟨10.1016/j.microrel.2020.113883⟩. ⟨hal-03011606⟩

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